[esp-r] PCM Modelling

[Mike Whalley]

Hi to All

 

I'd like to get some help modelling PCM in the active materials section of
Special Components in esp-r.  In particular I'd like to make sure that I
understand the inputs:

 

Melting temperature - the temperature at which the solid PCM begins to melt.
I'd expect this to be lower than the solidification temperature

Solidification temperature - the temperature at which the liquid PCM begins
to freeze.  I'd expect this to be higher than the melting temperature.

Conductivity in solid phase - self explanatory

Conductivity in liquid phase - self explanatory

Specific heat - is this taken at solid or liquid phase.

Latent heat member a, latent heat member b - I'm not sure what are members a
and b

 

Do the properties above apply to the PCM or to the complete compound, ie if
PCM is encapsulated 50/50 in wallboard are the wallboard properties entered
as normal in the materials database and the PCM properties in the special
components file?

 

Any help would be much appreciated

 

 

Mike Whalley CEng MCIBSE

Principal Director

 

Building Performance Analysis Limited

PO Box 3516

Bath

BA1 1ZN

 

Tel:01225 920796

Mob:07919 993610

 <mailto:mike at bldgperformance.co.uk> mike at bldgperformance.co.uk

 <http://www.bldgperformance.co.uk> www.bldgperformance.co.uk

 

 

 

 

 

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